With smartphone chipsets reaching higher performance levels, thermal management is increasingly a constraint. Reports from supply-chain sources and Chinese social media tipsters indicate Qualcomm could adopt Samsung’s Heat Pass Block (HPB) cooling system in the Snapdragon 8 Elite Gen 6 to mitigate growing heat issues. The development follows Qualcomm’s growing focus on benchmark dominance, which … Continue reading Qualcomm Rumored to Use Samsung Cooling Technology for Upcoming Snapdragon Chip