Betting on continued growth in AI workloads, SK Hynix is committing $12.9 billion to build a new advanced packaging plant in Cheongju. The P&T7 facility is designed to expand the company’s high-bandwidth memory output, which has become central to modern AI accelerators. The project is slated to break ground in April 2026 and reach completion … Continue reading SK Hynix Accelerates HBM Push With Massive $12.9 Billion Packaging Plant Investment